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Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll

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Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll

Brand Name : JIMA

Model Number : EDCU-HC

Certification : SGS, ISO,Reach, RoHS

Place of Origin : China

MOQ : 100kg

Price : negotiation

Payment Terms : T/T, L/C

Supply Ability : 1000 Ton per month

Delivery Time : 5-15 days

Packaging Details : wooden carton

Purity : 99.95%

Anti oxidation : 180 degree 60 minutes, 180 days 23 degree

Thickness : 1/2 oz,3/4 oz,1 oz,2 oz,

Color : red or black

Elongation : ≥ 1.5%

Tensile strength : ≥ 160 MPa

Peel strength : ≥ 1 N/mm

Foil profile : RA≤0.15μm,Rz≤1.7μm

Length Per Roll : 500 - 5000 Meter

Inter Diameter : 76 Mm,152 Mm, 3 Inch,6 Inch

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350kgs big roll HTE ED electrolytic copper foil for printed circuit board PCB​ antenna PCB

Detail Specification:

Single side treatment in red.
Nominal Thickness: 0.012-0.070 mm
Width range: 5-1380mm,standard width:1290mm
Length range : 500-5000 M
Internal diameter: 3 inch/6 inch.
stype:matte

Classify:

(STD-E)- standard electrodeposited copper foil.

(HD-E)-high ductility electrodeposited copper foil.

(HTE-E)-high temperature elongation electrodeposited copper foil.

Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll

Copper foil Applicatio

PCB industry .
application PCB manufacture
antenna PCB,Epoxy board
Epoxy board

FAQ:

Q1: Can you customize the special size as per our requirement?

A:we can cut into as your request size.

Q16. How to save after the box opened?

A: Keep the dry environment,and is better use it in 30days.

Q4: Can you supply the sample?

A: We can supply A4 samples

HTE ED copper foil Technical Terms (high elongation copper foil at high temperature).

Thickness um 9 12 18 25 35 70

IPC 4562

4.6.3.1

Area weight g/m² 80±1 107±3 153± 215±5 285±5 585±8

IPC 4562

4.6.3.2

Roughness (RA) μm 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4 0.2-0.4

IPC 4562

4.6.9

(RZ) μm <6.0 <6.5 <8.0 <9.0 ≤10.0 <15

Copper≧

% 99.8

IPC 4562

4.6.3.1

Tensile Strength state normal Mpa >300 >300 >300 >300 >300 >280

IPC 4562

4.6.4

state temper (180℃) Mpa >15.0 >18.0 >18.0 >18.0 >18.0 >18.0
ElongationI state normal % >3.0 >3.0 >5.0 >6.0 >10.0 >10.0

IPC 4562

3.5.3

state temper (180℃) % >2.0 >2.5 >2.5 >3.0 >5.0 >5.0
Peel strength N/mm >1.0 >1.05 >1.35 >1.70 >1.8 >2.0

IPC 4562

4.6.7

High temperature oxidation resistance(200℃,

40min)

No color change Standard
Solderability Good Standard
Solderability Good

IPC 4562

4.6.12

3. Standard Width,1295(±1)mm,May according to the customer request tailor.

We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp


Product Tags:

electrodeposited copper foil

      

copper thin sheet

      
China Electrolytic HTE Copper Foil For Printed Circuit Board 350kg Big Roll wholesale

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