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Good Etch Ability Copper Foil Sheet HTE 17um For High Speed Circuit / CCL

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Good Etch Ability Copper Foil Sheet HTE 17um For High Speed Circuit / CCL

Name: Good Etch Ability Copper Foil Sheet HTE 17um For High Speed Circuit CCL
Brand: JIMA
Price: 1 USD

Brand Name : JIMA

Model Number : EDCUHTE

Certification : ISO9001：2008,ISO14001:2004，T28001-2011

Place of Origin : CHINA

MOQ : Negotiations

Price : Negotiations

Payment Terms : L/C, T/T

Supply Ability : 6000MT per year

Delivery Time : 10~20days

Packaging Details : wooden box

Name : HTE 17um ED copper foil for High speed circuit with Good etch ability

standard : IPC 4562

package : standard wooden box

application : pcb/ CCL

thickness : 17um,0.017mm

Weight : 100~500kgs/roll

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HTE 17um ED copper foil for High speed circuit with Good etch ability.

Products Detail:

a.single side side treatment low profile foil in back/red.

b.Nominal Thickness: 0.017mm.

c.Width: 5-1380mm,standard width:1290mm.

d.ID: 76 mm,152 mm.

e.Cu purity :99.8%.

f.Quality standard:IPC 4562.

Products use Application:

1.Polyimide board

2.Epoxy board

3.PCB and antenna PCB,FPC

Description.

.Excellent adhesion to etching resist..

.Anti foil cracking by high elongation at elevated temperature.

.Eco-friendly products and processes.

Compare between CA copper foil and ED copper foil

1. Density: rolled copper foil higher density, the surface is relatively smooth, conducive to the production of printed circuit board after the rapid transmission of the signal, so high-frequency high-speed transmission, fine lines printed circuit board also used some calendering copper Foil.

2. Surface treatment width:rolled copper foil be limited by Surface treatment widest effective width of 520mm.

HTE copper foil Technical Parameters sheet (high elongation copper foil at high temperature)

Thickness		um	9	12	18	25	35	70	IPC 4562 4.6.3.1
Area weight		g/m²	80±1	107±3	153±	215±5	285±5	585±8	IPC 4562 4.6.3.2
Roughness	(RA)	μm	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	0.2-0.4	IPC 4562 4.6.9
Roughness	(RZ)	μm	<6.0	<6.5	<8.0	<9.0	≤10.0	<15	IPC 4562 4.6.9
Copper≥		%	99.8						IPC 4562 4.6.3.1
Tensile Strength	state normal	Mpa	>300	>300	>300	>300	>300	>280	IPC 4562 4.6.4
Tensile Strength	state temper (180℃)	Mpa	>15.0	>18.0	>18.0	>18.0	>18.0	>18.0	IPC 4562 4.6.4
ElongationI	state normal	%	>3.0	>3.0	>5.0	>6.0	>10.0	>10.0	IPC 4562 3.5.3
ElongationI	state temper (180℃)	%	>2.0	>2.5	>2.5	>3.0	>5.0	>5.0	IPC 4562 3.5.3
Peel strength		N/mm	>1.0	>1.05	>1.35	>1.70	>1.8	>2.0	IPC 4562 4.6.7
High temperature oxidation resistance(200℃, 40min)		No color change							Standard
Solderability		Good							Standard
Solderability		Good							IPC 4562 4.6.12

Remark:

1.Standard Width,1295(±1)mm,May according to the customer request tailor.

2.We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.

FAQ:

Q1. Is it possible be zinc free copper foil?

Yes ,we can do it.

Q2. Can you provide COA?

Yes , we can.

Q3. Is it the Fumigation carton box?

Yes ,it is .

Product Tags:

edco copper foil

copper foil paper

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